| Current teams : | ALMASTY ALSOC APR BD CIAN ComplexNetworks DECISION DELYS LFI MOCAH MoVe NPA PEQUAN PolSys QI RO SMA SYEL |
| Former team : | ACASA |
| Publications CIAN | 2023 | 2024 | Total |
|---|---|---|---|
| Books | 0 | 0 | 0 |
| Edited books | 0 | 0 | 0 |
| Journal articles | 7 | 2 | 9 |
| Book chapters | 1 | 0 | 1 |
| Conference papers | 6 | 2 | 8 |
| Habilitations | 0 | 0 | 0 |
| Thesis | 2 | 1 | 3 |
- Ah. Chaouche, J.‑M. Ilié, A. Hebik, F. Pêcheux : “Integration of a Contextual Observation System in a Multi-Process Architecture for Autonomous Vehicles”, Computing and Informatics, vol. 42 (3), pp. 716-740, (Slovak University Press, Bratislava) [Chaouche 2023]
- A. Díaz‑Rizo, H. Aboushady, Haralampos‑G. Stratigopoulos : “Anti-Piracy Design of RF Transceivers”, IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 70 (1), pp. 492-505, (IEEE) [Díaz-Rizo 2023a]
- A. Díaz‑Rizo, H. Aboushady, Haralampos‑G. Stratigopoulos : “Leaking Wireless ICs via Hardware Trojan-Infected Synchronization”, IEEE Transactions on Dependable and Secure Computing, vol. 20 (5), pp. 3845-3859, (Institute of Electrical and Electronics Engineers) [Díaz-Rizo 2023b]
- S. El‑Sayed, Th. Spyrou, L. Camuñas‑Mesa, Haralampos‑G. Stratigopoulos : “Compact Functional Testing for Neuromorphic Computing Circuits”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 42 (7), pp. 2391-2403, (IEEE) [El-Sayed 2023]
- W. Guo, K. Yang, Haralampos‑G. Stratigopoulos, H. Aboushady, Kh. Salama : “An End-To-End Neuromorphic Radio Classification System with an Efficient Sigma-Delta-Based Spike Encoding Scheme”, IEEE Transactions on Artificial Intelligence, pp. 1-14, (IEEE) [Guo 2023]
- H. Li, M. Trocan, M. Sawan, D. Galayko : “ICRICS: iterative compensation recovery for image compressive sensing”, Signal, Image and Video Processing, (Springer Verlag) [Li 2023]
- F. Su, Ch. Liu, Haralampos‑G. Stratigopoulos : “Testability and Dependability of AI Hardware: Survey, Trends, Challenges, and Perspectives”, IEEE Design & Test, vol. 40 (2), pp. 8-58, (IEEE) [Su 2023]