E. Lao, M.‑M. Louërat, J.‑P. Chaput : “Semi-automated analog placement”, Electronics, Circuits and Systems (ICECS), 2016 IEEE International Conference on, Monte Carlo, Monaco, pp. 432-433 (2016)
H. Zou, Y. Moursy, R. Iskander, J.‑P. Chaput, M.‑M. Louërat, C. Stefanucci, P. Buccella, M. Kayal, J.‑M. Sallese, Th. Gneiting, H. Alius, A. Steinmair, Eh. Seebacher : “A CAD integrated solution of substrate modeling for industrial IC design”, 2015 20th International Mixed-Signal Testing Workshop (IMSTW), Paris, France (2015)
H. Zou, Y. Moursy, R. Iskander, M.‑M. Louërat, J.‑P. Chaput : “A novel CAD framework for substrate modeling”, 10th Conference on Ph.D Research in Microelectronics and electronics, Grenoble, France, pp. 1-4, (IEEE) (2014)
2013
Y. Moursy, S. Afara, P. Buccella, C. Stefanucci, R. Iskander, M. Kayal, J.‑M. Sallese, M.‑M. Louërat, J.‑P. Chaput, M. Thomas Tomasevic , S. Ben Dhia, A. Boyer, B. Guegan, V. Poletto, A. Roggero, T. Cavioni, E. Novarini, Eh. Seebacher, A. Steinmair, P. Tisserand, D.‑M. Ton, Th. Bousquet, Th. Gneiting : “AUTOMICS: A novel approach for substrate modeling for Automotive applications”, 18th IEEE European Test Symposium, Avignon, France (2013)